Sound Chi Electric Launches New Integrated Circuit
2024/01/05
Netizens often ask that the withstand voltage of the aluminum substrate is OK when measuring the plate, but why is the aluminum substrate not good after forming? Now the sincere and beneficial editor will learn with everyone:
So the aluminum substrate pressure is not good is mainly caused by the situation?
First of all, we first consider that the safe distance of the aluminum substrate is too small during design. According to industry rules, the safe distance of conduction (the distance from copper to aluminum) must be greater than 1mm at 1000V, 2mm at 2000V, and 3mm at 3000V. The safe distance mentioned here refers to: the front of the aluminum substrate forming, the front of the hole ring, and the offset of the hole position during forming. These three points are common problems in the production of the aluminum substrate PCB factory.
Secondly, consider the deviation of the aluminum substrate forming hole: if there is a hole ring at the edge of the hole, this deviation will cause the hole ring to be too close to the aluminum base. In the high-voltage test, due to the high voltage on the aluminum surface, a discharge phenomenon will be formed at the position of the hole ring, resulting in upward ignition. The hole location can be visually inspected for undesirable blackening spots.
Consider the wear surface of the hole ring again: the main manifestation of the wear surface of the hole ring is that the hole wall is not well treated after forming and there are debris in the hole. In the high voltage test, the power generated by the tip is caused by debris, and the aluminum discharges unevenly to the dielectric layer, causing upward ignition, which can lead to visual inspection of defect points.
The final forming front: mainly because when there is a burr on the forming edge, during the high-voltage test, due to the insufficient safety distance of the copper surface, the aluminum front end forms a tip discharge, the ignition point is located at the edge of the board, and the defect point can be seen near the copper surface on the edge of the board.
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