Sound Chi Electric Launches New Integrated Circuit

2024/01/05

Netizens often ask that the withstand voltage of the aluminum substrate is OK when measuring the plate, but why is the aluminum substrate not good after forming? Now the sincere and beneficial editor will learn with everyone:

So the aluminum substrate pressure is not good is mainly caused by the situation?

First of all, we first consider that the safe distance of the aluminum substrate is too small during design. According to industry rules, the safe distance of conduction (the distance from copper to aluminum) must be greater than 1mm at 1000V, 2mm at 2000V, and 3mm at 3000V. The safe distance mentioned here refers to: the front of the aluminum substrate forming, the front of the hole ring, and the offset of the hole position during forming. These three points are common problems in the production of the aluminum substrate PCB factory.

Secondly, consider the deviation of the aluminum substrate forming hole: if there is a hole ring at the edge of the hole, this deviation will cause the hole ring to be too close to the aluminum base. In the high-voltage test, due to the high voltage on the aluminum surface, a discharge phenomenon will be formed at the position of the hole ring, resulting in upward ignition. The hole location can be visually inspected for undesirable blackening spots.

Consider the wear surface of the hole ring again: the main manifestation of the wear surface of the hole ring is that the hole wall is not well treated after forming and there are debris in the hole. In the high voltage test, the power generated by the tip is caused by debris, and the aluminum discharges unevenly to the dielectric layer, causing upward ignition, which can lead to visual inspection of defect points.
The final forming front: mainly because when there is a burr on the forming edge, during the high-voltage test, due to the insufficient safety distance of the copper surface, the aluminum front end forms a tip discharge, the ignition point is located at the edge of the board, and the defect point can be seen near the copper surface on the edge of the board.

Related News

05

2024/01

CAM Engineer's Questions about Design Data

1.99SE and DXP software design, the board frame has GM1 layer and keepout layer, cam engineers will choose one of them as the board frame layer, if the two layers are inconsistent, engineers will propose EQ, especially the fixed screw holes, GM1 layer and keepout layer often appear inconsistent. Occasionally there will be extra 2D lines.

05

2024/01

Characteristics of circuit board three anti-paint

Three anti-paint is a special formula of paint, used to protect the circuit board and its related equipment from bad environment, so as to improve and extend their service life, to ensure the safety and reliability of the use. Under realistic conditions, such as chemical environment (fuel, coolant, etc.), vibration, high dust, salt spray, humidity and high temperature, the circuit board may produce corrosion, softening, deformation, mildew and other problems, resulting in circuit board circuit failure. The three-proof paint is applied to the exterior of the circuit board to form a light and flexible film with a thickness of about 25-50 microns. It can protect the circuit from damage under the above harsh conditions.

01

2023/12

PCB Allegro proofing when these matters need to pay attention

Usually, enterprises will produce small samples for testing before mass production of PCB, which is what we often call rapid proofing of PCB. At present, there are many manufacturers specializing in PCB proofing, and enterprises can choose suitable PCB manufacturers to cooperate according to their own product needs. So, do you know what you need to pay attention to in the rapid proofing process of PCB board: