The new integrated circuit of Shengchi Electric Appliance is amazing in Zhuhai
2024/01/05
Although the technology of double-sided aluminum substrate is constantly improving, there are still many problems in the production process of aluminum substrate at this stage.
led double sided aluminum substrate production:
(1) Oxidation treatment of aluminum plate: strong degreasing cleaning (sodium hydroxide)-neutralization with dilute nitric acid-roughening (honeycomb formation on aluminum plate surface)-oxidation (3UM)-acid-base neutralization-hole sealing-baking. Each process must ensure the quality otherwise affect the aluminum substrate adhesion.
(2) The entire production process is not allowed to wipe the aluminum base surface, not to touch the aluminum base, moisture and any other pollution, otherwise it will affect the adhesion of the aluminum substrate.
(3) The insulating layer of the aluminum substrate must be kept clean and dry. Small impurities affect its pressure resistance, and moisture can easily cause delamination.
(4) The protective film shall be smooth and free from voids and bubbles, otherwise the aluminum plate will be corroded and discolored by liquid medicine during circuit board processing.
LED double sided aluminum substrate line production:
(1) Machining:
The aluminum substrate can be drilled, but there is no burr on the inner hole edge after drilling, which will affect the pressure test. Milling the shape is very difficult. And punch shape, need to use advanced mold, mold production is very skillful, as one of the difficulties of aluminum substrate. After the shape is punched, the edge is required to be very neat, without any burr, and the solder mask on the edge of the board is not damaged. Usually, a combat die is used, the hole is punched from the line, the shape is punched from the aluminum surface, the stress is cut up and pulled down when the circuit board is punched, and so on are all skills. After the shape is punched, the warpage of the board shall be less than 0.5%.
(2) The aluminum base surface is not allowed to be rubbed in the whole production process: the aluminum base surface will change color and blacken when touched by hands or by certain chemicals, which is absolutely unacceptable. Some customers who re-polish the aluminum base surface will not accept it, so the whole process will not touch or touch the aluminum base surface is one of the difficulties in producing aluminum substrates. Some enterprises use passivation process, some in hot air leveling (spray
Tin) put protective films on the front and back......
(3) over-high voltage test: the aluminum substrate of communication power supply requires 100 percent high voltage test, some customers require direct current and some require alternating current, the voltage requires 1500V and 1600V, the time is 5 seconds and 10 seconds, and 100 percent printed circuit board is tested.
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