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05

2024/01

CAM Engineer's Questions about Design Data

1.99SE and DXP software design, the board frame has GM1 layer and keepout layer, cam engineers will choose one of them as the board frame layer, if the two layers are inconsistent, engineers will propose EQ, especially the fixed screw holes, GM1 layer and keepout layer often appear inconsistent. Occasionally there will be extra 2D lines.

05

2024/01

Characteristics of circuit board three anti-paint

Three anti-paint is a special formula of paint, used to protect the circuit board and its related equipment from bad environment, so as to improve and extend their service life, to ensure the safety and reliability of the use. Under realistic conditions, such as chemical environment (fuel, coolant, etc.), vibration, high dust, salt spray, humidity and high temperature, the circuit board may produce corrosion, softening, deformation, mildew and other problems, resulting in circuit board circuit failure. The three-proof paint is applied to the exterior of the circuit board to form a light and flexible film with a thickness of about 25-50 microns. It can protect the circuit from damage under the above harsh conditions.

01

2023/12

PCB Allegro proofing when these matters need to pay attention

Usually, enterprises will produce small samples for testing before mass production of PCB, which is what we often call rapid proofing of PCB. At present, there are many manufacturers specializing in PCB proofing, and enterprises can choose suitable PCB manufacturers to cooperate according to their own product needs. So, do you know what you need to pay attention to in the rapid proofing process of PCB board:

01

2023/12

The new integrated circuit of Shengchi Electric Appliance is amazing in Zhuhai

Although the technology of double-sided aluminum substrate is constantly improving, there are still many problems in the production process of aluminum substrate at this stage.

01

2023/12

The basic process of HDI

The more HDI stages, the more complex the process flow, but the basic process is roughly the same, just pressing and laser drilling, plating holes in copper, in a cyclic operation. With each repetition, the difficulty increases. Layers are closely related to each other.

01

2023/12

Electromagnetic Interference Suppression Design of PCB

The design of printed circuit board is an important part of making electronic products. With the rapid development of electronic technology, the density of PCB is getting higher and higher, and the quality of PCB design in circuit board factory has a great influence on anti-interference ability. If the design is unreasonable, it will produce electromagnetic interference, which will affect the performance of the circuit and even fail to work normally.

01

2023/12

Methods of suppressing electromagnetic interference

Electromagnetic interference can not be completely avoided, but in the design of printed circuit board can take some measures to try to suppress the interference intensity, improve the unit circuit itself anti-interference ability, avoid or reduce interference.

01

2023/12

What is the black object on the board?

Careful may find that there will be a lump of black things on some circuit boards, so what is this? Why is it on the circuit board and what is its function? In fact, this is a kind of package. We often call it "soft package". We say that its soft package is actually for "hard". Its constituent material is epoxy resin. We usually see that the receiving surface of the receiving head is also of this material. Inside it is a chip IC. This process is called "bonding" and we usually call it "binding".

01

2023/12

Sound Chi Electric Launches New Integrated Circuit

First of all, we first consider that the safe distance of the aluminum substrate is too small during design. According to industry rules, the safe distance of conduction (the distance from copper to aluminum) must be greater than 1mm at 1000V, 2mm at 2000V, and 3mm at 3000V. The safe distance mentioned here refers to: the front of the aluminum substrate forming, the front of the hole ring, and the offset of the hole position during forming. These three points are common problems in the production of the aluminum substrate PCB factory.

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